JPH0325409Y2 - - Google Patents
Info
- Publication number
- JPH0325409Y2 JPH0325409Y2 JP13926585U JP13926585U JPH0325409Y2 JP H0325409 Y2 JPH0325409 Y2 JP H0325409Y2 JP 13926585 U JP13926585 U JP 13926585U JP 13926585 U JP13926585 U JP 13926585U JP H0325409 Y2 JPH0325409 Y2 JP H0325409Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- heat sink
- semiconductor device
- cap
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 43
- 229920005989 resin Polymers 0.000 claims description 43
- 239000004065 semiconductor Substances 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 32
- 239000008188 pellet Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000000465 moulding Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13926585U JPH0325409Y2 (en]) | 1985-09-11 | 1985-09-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13926585U JPH0325409Y2 (en]) | 1985-09-11 | 1985-09-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6247136U JPS6247136U (en]) | 1987-03-23 |
| JPH0325409Y2 true JPH0325409Y2 (en]) | 1991-06-03 |
Family
ID=31045004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13926585U Expired JPH0325409Y2 (en]) | 1985-09-11 | 1985-09-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325409Y2 (en]) |
-
1985
- 1985-09-11 JP JP13926585U patent/JPH0325409Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6247136U (en]) | 1987-03-23 |
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